MPX2102DP vs MPX2100D Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPX2102DP disebabkan oleh NXP Semiconductors dan MPX2100D disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPX2102DP - 100kPa Differential Pressure Sensor, 4-SIP | NXP
MPX2102DP ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | MPX2102DP | MPX2100D |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Pressure Sensors | Pressure Sensors |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Jenis Sensus | Piezoresistive Pressure Sensor | — |
| Pressure Type | Differential (Dual Port) | Differential |
| Operating Pressure Range | 0 kPa to 100 kPa (0 PSI to 14.5 PSI) | 0 kPa to 100 kPa (0 to 14.5 psi) |
| Full-Scale Output | 0 mV to 40 mV at 10 V excitation | — |
| Supply Voltage (Excitation) | 10 V typical (max specified separately) | — |
| Port Size | Male, 0.19" (4.93 mm) tube, Dual | — |
| Gambaran Suhu Operasi | -40 °C to +125 °C | -40C to +125C [DATA_NEEDED: confirm exact range from datasheet] |
| Compensated Temperature Range | 0 °C to +85 °C | — |
| Kemasan / Case | 4-SIP Module (Unibody) | — |
| Termination Style | Through-Hole PCB | — |
| Jenis Output | Analog Wheatstone Bridge (ratiometric mV) | Analog ratiometric Wheatstone bridge (millivolts) |
| Technology | On-chip Temperature Compensated Silicon | Silicon piezoresistive MEMS strain-gauge bridge |
| Linearity | [DATA_NEEDED: typical linearity %FS] | 0.1% to 0.3% typical [DATA_NEEDED: confirm] |
| Sensitivity | [DATA_NEEDED: mV/V typical] | — |
| Jenis Pemasangan | Through-Hole, Dual Vertical Port | Through-hole SIP module |
| Series | MPX2102 | — |
| Full-Scale Span (Typical) | — | 40 mV at 10 V excitation |
| Sensitivity (Nominal) | — | 0.4 mV/kPa |
| Supply Voltage (Recommended) | — | 10 V DC |
| Supply Voltage (Maximum) | — | 16 V DC |
| Pressure Port Configuration | — | Dual axial ports (differential) |
| Kemasan | — | 4-SIP Unibody (UNIBODY4F), 2.54 mm pitch |
| Package Body Dimensions | — | 15.56 mm x 15.56 mm x 5.33 mm |
| On-Chip Temperature Compensation | — | Yes (factory laser-trimmed) |
| Status RoHS | — | Compliant [DATA_NEEDED: confirm from NXP product page] |
| Diaphragm Material | — | Silicon [DATA_NEEDED: confirm] |