MPXV12GW6U vs MPX5010DP तुलना
विस्तृत दोनों ओर की तुलना MPXV12GW6U द्वारा NXP Semiconductors और MPX5010DP द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | MPXV12GW6U | MPX5010DP |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | Pressure Sensors | Pressure Sensors |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Operating Pressure Range | 0 kPa to 10 kPa (1.45 PSI) | 0 kPa to 10 kPa (0 to 1.45 PSI) |
| आउटपुट प्रकार | Analog Millivolt (Wheatstone bridge) | Analog, ratiometric |
| Output Span | 0 mV to 55 mV at 3 V excitation | — |
| Excitation Voltage | 3 V typical | — |
| Pressure Port Type | Top port, 0.22" (5.59 mm) tube | — |
| पैकेज / केस | 8-SMD, Gull Wing, Top Port | — |
| माउंटिंग प्रकार | Surface Mount | Through-hole (SIP) |
| ऑपरेटिंग तापमान | -40 C to +125 C | 0 C to +85 C (compensated) |
| Accuracy | [DATA_NEEDED: linearity + temperature coefficient] | — |
| Configuration | Vented Gauge (reference to atmosphere) | — |
| Sensor Technology | Silicon piezoresistive (MEMS strain gauge) | — |
| Off-Pressure Offset | 0 mV minimum (no offset specified) | — |
| Compensation | Uncompensated (external calibration required) | — |
| RoHS स्थिति | Compliant | Compliant |
| MSL स्तर | [DATA_NEEDED: MSL rating] | — |
| Bridge Resistance | [DATA_NEEDED: input / output bridge impedance] | — |
| Typical Sensitivity | [DATA_NEEDED: mV/kPa at 3 V] | — |
| Pressure Type | — | Differential |
| Maximum Overload Pressure | — | [DATA_NEEDED: max overload kPa] |
| Sensitivity | — | 450 mV/kPa (typical) |
| आउटपुट वोल्टेज रेंज | — | 0.2 V to 4.7 V |
| सप्लाई वोल्टेज | — | 4.75 V to 5.25 V (5 V typical) |
| सप्लाई करंट | — | [DATA_NEEDED: supply current mA] |
| Linearity | — | ±1.5% VFSS (typical, 0-85 C) |
| Storage Temperature | — | [DATA_NEEDED: storage temperature C] |
| Port Configuration | — | Dual axial ports, 4.93 mm (0.19 in) tube |
| पैकेज | — | 6-SIP Module |
| Technology | — | Piezoresistive, monolithic silicon, on-chip signal conditioned |