MW4IC2230NBR1 vs MW4IC2230MBR5 तुलना
विस्तृत दोनों ओर की तुलना MW4IC2230NBR1 द्वारा NXP Semiconductors और MW4IC2230MBR5 द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
NXP Semiconductors
MW4IC2230NBR1 - 30W W-CDMA RF Power Amplifier, 1.6-2.4 GHz | NXP
MW4IC2230NBR1 Obsolete
विशेषता तुलना
| पैरामीटर | MW4IC2230NBR1 | MW4IC2230MBR5 |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | RF Amplifiers | RF Amplifiers |
| लाइफसाइकिल स्थिति | Obsolete | Obsolete |
| Technology | LDMOS (High Voltage, multi-stage integrated) | LDMOS (Laterally Diffused MOSFET) |
| Frequency Range | 1.6 GHz to 2.4 GHz (usable); 2110-2170 MHz target band | 1.6 GHz to 2.4 GHz |
| Test Frequency | 2.14 GHz | — |
| Supply Voltage (Drain) | 26 V to 28 V | — |
| Supply Current (Quiescent) | 60 mA nominal | — |
| Small-Signal Gain | 31 dB typical | — |
| Output Power (P1dB / Pout) | [DATA_NEEDED: P1dB / saturated Pout at W-CDMA] | — |
| Power Added Efficiency | [DATA_NEEDED: PAE typical] | — |
| Modulation Support | W-CDMA, CDMA, EDGE, GSM, TDMA | — |
| Input Impedance | 50 ohm (internally matched) | — |
| पैकेज | TO-272 WB-16 (over-molded plastic, flange mount) | — |
| माउंटिंग प्रकार | Surface / chassis mount via flange | Surface Mount (with heatsink) |
| Maximum Operating Temperature | 85 C | — |
| पिन काउंट | 16 | — |
| RoHS स्थिति | [DATA_NEEDED: RoHS / lead-free status from NXP product page] | [DATA_NEEDED: rohs status] |
| Application | Cellular base-station RF power amplifier | — |
| Lead Configuration | Flat leads (TO-272-16 Variant) | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Type | — | RF LDMOS Wideband Integrated Power Amplifier |
| Output Power (Pout) | — | 30 W (CW) |
| Power Gain | — | 31 dB (typical) |
| Supply Voltage (Vdd) | — | 26 V nominal |
| Quiescent Current (Idq) | — | 60 mA |
| पैकेज / केस | — | TO-272 WB-16 Variant, Flat Leads (over-molded plastic) |
| Operating Mode | — | Class AB (typical) |
| Supported Air Interfaces | — | Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA |
| Input Matching | — | Internal wideband matching network |
| Lead Finish | — | [DATA_NEEDED: lead finish] |
| MSL स्तर | — | [DATA_NEEDED: MSL level] |