MW4IC2230NBR1 vs MW4IC2230MBR5 Karşılaştırma
Ayrıntılı yan yana karşılaştırma MW4IC2230NBR1 tarafından NXP Semiconductors ve MW4IC2230MBR5 tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
MW4IC2230NBR1 - 30W W-CDMA RF Power Amplifier, 1.6-2.4 GHz | NXP
MW4IC2230NBR1 Obsolete
Özellik Karşılaştırması
| Parametre | MW4IC2230NBR1 | MW4IC2230MBR5 |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | RF Amplifiers | RF Amplifiers |
| Yaşam Döngüsü Durumu | Obsolete | Obsolete |
| Technology | LDMOS (High Voltage, multi-stage integrated) | LDMOS (Laterally Diffused MOSFET) |
| Frequency Range | 1.6 GHz to 2.4 GHz (usable); 2110-2170 MHz target band | 1.6 GHz to 2.4 GHz |
| Test Frequency | 2.14 GHz | — |
| Supply Voltage (Drain) | 26 V to 28 V | — |
| Supply Current (Quiescent) | 60 mA nominal | — |
| Small-Signal Gain | 31 dB typical | — |
| Output Power (P1dB / Pout) | [DATA_NEEDED: P1dB / saturated Pout at W-CDMA] | — |
| Power Added Efficiency | [DATA_NEEDED: PAE typical] | — |
| Modulation Support | W-CDMA, CDMA, EDGE, GSM, TDMA | — |
| Input Impedance | 50 ohm (internally matched) | — |
| Paket | TO-272 WB-16 (over-molded plastic, flange mount) | — |
| Montaj Türü | Surface / chassis mount via flange | Surface Mount (with heatsink) |
| Maximum Operating Temperature | 85 C | — |
| Pin Sayısı | 16 | — |
| RoHS Durumu | [DATA_NEEDED: RoHS / lead-free status from NXP product page] | [DATA_NEEDED: rohs status] |
| Application | Cellular base-station RF power amplifier | — |
| Lead Configuration | Flat leads (TO-272-16 Variant) | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Type | — | RF LDMOS Wideband Integrated Power Amplifier |
| Output Power (Pout) | — | 30 W (CW) |
| Power Gain | — | 31 dB (typical) |
| Supply Voltage (Vdd) | — | 26 V nominal |
| Quiescent Current (Idq) | — | 60 mA |
| Paket / Kas | — | TO-272 WB-16 Variant, Flat Leads (over-molded plastic) |
| Operating Mode | — | Class AB (typical) |
| Supported Air Interfaces | — | Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA |
| Input Matching | — | Internal wideband matching network |
| Lead Finish | — | [DATA_NEEDED: lead finish] |
| MSL Seviyesi | — | [DATA_NEEDED: MSL level] |