MW4IC2230NBR1 vs MW4IC2230MBR5 Perbandingan
Perbandingan bersamaan detil MW4IC2230NBR1 dari NXP Semiconductors dan MW4IC2230MBR5 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MW4IC2230NBR1 - 30W W-CDMA RF Power Amplifier, 1.6-2.4 GHz | NXP
MW4IC2230NBR1 Obsolete
Perbandingan Spesifikasi
| Parameter Umum | MW4IC2230NBR1 | MW4IC2230MBR5 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | RF Amplifiers | RF Amplifiers |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Technology | LDMOS (High Voltage, multi-stage integrated) | LDMOS (Laterally Diffused MOSFET) |
| Frequency Range | 1.6 GHz to 2.4 GHz (usable); 2110-2170 MHz target band | 1.6 GHz to 2.4 GHz |
| Test Frequency | 2.14 GHz | — |
| Supply Voltage (Drain) | 26 V to 28 V | — |
| Supply Current (Quiescent) | 60 mA nominal | — |
| Small-Signal Gain | 31 dB typical | — |
| Output Power (P1dB / Pout) | [DATA_NEEDED: P1dB / saturated Pout at W-CDMA] | — |
| Power Added Efficiency | [DATA_NEEDED: PAE typical] | — |
| Modulation Support | W-CDMA, CDMA, EDGE, GSM, TDMA | — |
| Input Impedance | 50 ohm (internally matched) | — |
| Paket | TO-272 WB-16 (over-molded plastic, flange mount) | — |
| Tipe Mounting | Surface / chassis mount via flange | Surface Mount (with heatsink) |
| Maximum Operating Temperature | 85 C | — |
| Jumlah Pin | 16 | — |
| Status RoHS | [DATA_NEEDED: RoHS / lead-free status from NXP product page] | [DATA_NEEDED: rohs status] |
| Application | Cellular base-station RF power amplifier | — |
| Lead Configuration | Flat leads (TO-272-16 Variant) | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Type | — | RF LDMOS Wideband Integrated Power Amplifier |
| Output Power (Pout) | — | 30 W (CW) |
| Power Gain | — | 31 dB (typical) |
| Supply Voltage (Vdd) | — | 26 V nominal |
| Quiescent Current (Idq) | — | 60 mA |
| Paket / Case | — | TO-272 WB-16 Variant, Flat Leads (over-molded plastic) |
| Operating Mode | — | Class AB (typical) |
| Supported Air Interfaces | — | Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA |
| Input Matching | — | Internal wideband matching network |
| Lead Finish | — | [DATA_NEEDED: lead finish] |
| Level MSL | — | [DATA_NEEDED: MSL level] |