10AS032H1F34E1HG vs 10AS032H2F34E2LG Perbandingan
Perbandingan bersamaan detil 10AS032H1F34E1HG dari Intel dan 10AS032H2F34E2LG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
10AS032H1F34E1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel (Altera)
10AS032H1F34E1HG ✓ Aktif
Perbandingan Spesifikasi
| Parameter Umum | 10AS032H1F34E1HG | 10AS032H2F34E2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Family | Arria 10 SX | — |
| Architecture | 20nm SoC FPGA (FPGA + hard ARM Cortex-A9 subsystem) | — |
| Logic Elements | 320,000 | 320,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 1.5 GHz | — |
| On-chip Memory | Approx. 21 Mb (M20K blocks) | — |
| Transceivers | Up to 24 channels, up to 17.4 Gbps | Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] |
| DSP Blocks | Variable-precision hardened DSP with floating-point | Variable-precision, IEEE 754 single-precision FP support |
| Hard Memory Controllers | DDR4 up to 2133 Mbps, DDR3, QDRII+, RLDRAM3 | — |
| PCIe Hard IP | PCIe Gen3 x8 | — |
| Paket | 1152-ball FCBGA (35 x 35 mm) | 1152-ball FC-FBGA (F34), 35 x 35 mm |
| Operating Temperature (E1 suffix) | 0C to +100C (extended) | — |
| Tipe Mounting | Surface Mount, flip-chip BGA | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Pin/Ball Count | 1152 | — |
| Family | — | Arria 10 SX |
| Device Tier | — | 10AS032 (mid-density) |
| Configuration | — | SoC FPGA (HPS + FPGA fabric) |
| Processor Subsystem | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Operating Frequency | — | 1.5 GHz |
| Speed Grade | — | 2 |
| Temperature Grade | — | E2 (commercial/extended) |
| On-chip Memory (M20K blocks) | — | Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] |
| Memory Controller Hard IP | — | DDR4, DDR3, QDRII+, RLDRAM3 |
| Process Node | — | 20 nm |
| Form of Terminal | — | Ball (BGA) |
| Terminal Pitch | — | 1 mm |