10AS032H1F34E1HG vs 10AS032H2F34E2LG Karşılaştırma
Ayrıntılı yan yana karşılaştırma 10AS032H1F34E1HG tarafından Intel ve 10AS032H2F34E2LG tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Intel
10AS032H1F34E1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel (Altera)
10AS032H1F34E1HG ✓ Aktif
Özellik Karşılaştırması
| Parametre | 10AS032H1F34E1HG | 10AS032H2F34E2LG |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Device Family | Arria 10 SX | — |
| Architecture | 20nm SoC FPGA (FPGA + hard ARM Cortex-A9 subsystem) | — |
| Logic Elements | 320,000 | 320,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 1.5 GHz | — |
| On-chip Memory | Approx. 21 Mb (M20K blocks) | — |
| Transceivers | Up to 24 channels, up to 17.4 Gbps | Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] |
| DSP Blocks | Variable-precision hardened DSP with floating-point | Variable-precision, IEEE 754 single-precision FP support |
| Hard Memory Controllers | DDR4 up to 2133 Mbps, DDR3, QDRII+, RLDRAM3 | — |
| PCIe Hard IP | PCIe Gen3 x8 | — |
| Paket | 1152-ball FCBGA (35 x 35 mm) | 1152-ball FC-FBGA (F34), 35 x 35 mm |
| Operating Temperature (E1 suffix) | 0C to +100C (extended) | — |
| Montaj Türü | Surface Mount, flip-chip BGA | Surface Mount (BGA) |
| RoHS Durumu | Compliant | Compliant |
| Pin/Ball Count | 1152 | — |
| Family | — | Arria 10 SX |
| Device Tier | — | 10AS032 (mid-density) |
| Configuration | — | SoC FPGA (HPS + FPGA fabric) |
| Processor Subsystem | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Operating Frequency | — | 1.5 GHz |
| Speed Grade | — | 2 |
| Temperature Grade | — | E2 (commercial/extended) |
| On-chip Memory (M20K blocks) | — | Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] |
| Memory Controller Hard IP | — | DDR4, DDR3, QDRII+, RLDRAM3 |
| Process Node | — | 20 nm |
| Form of Terminal | — | Ball (BGA) |
| Terminal Pitch | — | 1 mm |