10AS032H1F34E1HG vs 10AS032H2F34E2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AS032H1F34E1HG sa pamamagitan ng Intel at 10AS032H2F34E2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AS032H1F34E1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel (Altera)
10AS032H1F34E1HG ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | 10AS032H1F34E1HG | 10AS032H2F34E2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Family | Arria 10 SX | — |
| Architecture | 20nm SoC FPGA (FPGA + hard ARM Cortex-A9 subsystem) | — |
| Logic Elements | 320,000 | 320,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 1.5 GHz | — |
| On-chip Memory | Approx. 21 Mb (M20K blocks) | — |
| Transceivers | Up to 24 channels, up to 17.4 Gbps | Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] |
| DSP Blocks | Variable-precision hardened DSP with floating-point | Variable-precision, IEEE 754 single-precision FP support |
| Hard Memory Controllers | DDR4 up to 2133 Mbps, DDR3, QDRII+, RLDRAM3 | — |
| PCIe Hard IP | PCIe Gen3 x8 | — |
| Packhaging | 1152-ball FCBGA (35 x 35 mm) | 1152-ball FC-FBGA (F34), 35 x 35 mm |
| Operating Temperature (E1 suffix) | 0C to +100C (extended) | — |
| Uri ng Pagpapasok | Surface Mount, flip-chip BGA | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Pin/Ball Count | 1152 | — |
| Family | — | Arria 10 SX |
| Device Tier | — | 10AS032 (mid-density) |
| Configuration | — | SoC FPGA (HPS + FPGA fabric) |
| Processor Subsystem | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Operating Frequency | — | 1.5 GHz |
| Speed Grade | — | 2 |
| Temperature Grade | — | E2 (commercial/extended) |
| On-chip Memory (M20K blocks) | — | Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] |
| Memory Controller Hard IP | — | DDR4, DDR3, QDRII+, RLDRAM3 |
| Process Node | — | 20 nm |
| Form of Terminal | — | Ball (BGA) |
| Terminal Pitch | — | 1 mm |