10AX090S3F45E2LG vs 10AX090R3F40E2LG Perbandingan
Perbandingan bersamaan detil 10AX090S3F45E2LG dari Intel dan 10AX090R3F40E2LG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10AX090S3F45E2LG | 10AX090R3F40E2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria 10 GX | — |
| Logic Elements | 900,000 | 900,000 |
| Adaptive Logic Modules (ALMs) | 339,620 | — |
| Embedded Memory (bits) | 59,234,304 | — |
| DSP Blocks | 1,518 | Hardened fixed/floating-point DSP blocks (on-die) |
| Transceivers | 624 (per package aggregate channels) | Multi-gigabit serial transceivers (on-die) |
| Maximum Transceiver Data Rate | 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT) | — |
| Paket | 1932-ball FCBGA (F45, 45mm flip-chip BGA) | 1517-Ball FCBGA |
| Process Node | TSMC 20nm | — |
| Core Voltage (nominal) | 0.9 V | — |
| User I/O Banks | 12 | — |
| Maximum User I/O | 624 | — |
| Rentang Suhu Kerja | 0C to 100C (E2 commercial) | — |
| Speed Grade | S3 (-2 speed grade equivalent) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Memory Interfaces | DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3 | Hardened DDR3/DDR4 memory controller IP |
| Family | — | Arria 10 GX |
| Embedded Memory | — | 59,234,304 bits |
| User I/O Count | — | 342 |
| Process Technology | — | 20 nm |
| Core Supply Voltage | — | 0.9 V |
| Package Type | — | Flip-Chip Ball Grid Array |
| Number of Terminals | — | 1517 |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |