10AX090S3F45E2LG vs 10AX090R3F40E2LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX090S3F45E2LG disebabkan oleh Intel dan 10AX090R3F40E2LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX090S3F45E2LG | 10AX090R3F40E2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria 10 GX | — |
| Logic Elements | 900,000 | 900,000 |
| Adaptive Logic Modules (ALMs) | 339,620 | — |
| Embedded Memory (bits) | 59,234,304 | — |
| DSP Blocks | 1,518 | Hardened fixed/floating-point DSP blocks (on-die) |
| Transceivers | 624 (per package aggregate channels) | Multi-gigabit serial transceivers (on-die) |
| Maximum Transceiver Data Rate | 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT) | — |
| Kemasan | 1932-ball FCBGA (F45, 45mm flip-chip BGA) | 1517-Ball FCBGA |
| Process Node | TSMC 20nm | — |
| Core Voltage (nominal) | 0.9 V | — |
| User I/O Banks | 12 | — |
| Maximum User I/O | 624 | — |
| Gambaran Suhu Operasi | 0C to 100C (E2 commercial) | — |
| Speed Grade | S3 (-2 speed grade equivalent) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Memory Interfaces | DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3 | Hardened DDR3/DDR4 memory controller IP |
| Family | — | Arria 10 GX |
| Embedded Memory | — | 59,234,304 bits |
| User I/O Count | — | 342 |
| Process Technology | — | 20 nm |
| Core Supply Voltage | — | 0.9 V |
| Package Type | — | Flip-Chip Ball Grid Array |
| Number of Terminals | — | 1517 |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |