10M25DAF256I7P vs 10M25DAF256C8G Perbandingan
Perbandingan bersamaan detil 10M25DAF256I7P dari Intel dan 10M25DAF256C8G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M25DAF256I7P | 10M25DAF256C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 25000 | 25,000 |
| Embedded Memory (M9K) | 1134 Kbits | — |
| Embedded Multipliers (18x18) | 50 | — |
| PLLs | 4 | 4 |
| Maximum User I/Os | 178 | — |
| On-die Flash Configuration | Dual-configuration supported | — |
| ADC | 12-bit, 1 MSPS, up to 16 analog inputs | — |
| Process Technology | 55 nm | — |
| Core Voltage | 1.2 V | [DATA_NEEDED: core voltage] |
| Suhu Kerja | -40C to +100C (Industrial) | — |
| Paket | 256-pin FBGA (17 mm x 17 mm) | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Configuration Memory | On-chip flash (volatile mode optional) | — |
| Speed Grade | 7 | C8 |
| Status RoHS | Compliant | Compliant |
| Embedded Memory | — | 1,728 Kbits |
| Embedded 18x18 Multipliers | — | 55 |
| User I/O Count | — | 178 |
| Hard ADC Blocks | — | 2 (12-bit) |
| Configuration Flash | — | Internal, non-volatile |
| Process Node | — | 55 nm TSMC |
| Temperature Grade | — | Commercial (0 °C to 85 °C) |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL |
| Lead-Free / Halogen-Free | — | Yes / Yes |
| Level MSL | — | [DATA_NEEDED: MSL level] |