10M25DAF484C8G vs 10M25DAF484A7P Perbandingan
Perbandingan bersamaan detil 10M25DAF484C8G dari Intel dan 10M25DAF484A7P dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M25DAF484C8G | 10M25DAF484A7P |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | — |
| Logic Elements | 25,000 | 25,000 |
| Embedded Memory (Kbits) | 1638 | — |
| User I/O Count | 360 | — |
| Process Technology | 55 nm CMOS | 55 nm non-volatile |
| Core Supply Voltage (VCCINT) | 1.2 V (1.15 V min / 1.25 V max) | — |
| Paket | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-ball Plastic BGA (S-PBGA-B484) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | 0 °C to 85 °C (Commercial) | — |
| Speed Grade | -8 | A7 |
| Configuration Memory | On-chip dual-configuration flash | — |
| ADC | Integrated 12-bit ADC (where enabled) | — |
| PLLs | Yes (up to 4 analog PLLs per device) | 2 (general-purpose) |
| Status RoHS | Compliant | Compliant |
| Level MSL | MSL3 | — |
| Number of I/O Banks | 8 (per F484 pinout) | — |
| Series | — | MAX 10 |
| Configurable Logic Blocks (CLBs) | — | 1,563 |
| Embedded Memory | — | 1,728 Kbits |
| Maximum User I/O | — | 360 |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Temperature Grade | — | Automotive (-40 C to +125 C TJ) |
| Configuration | — | Internal dual-boot flash (no external PROM) |
| On-chip ADC | — | 1 x 12-bit, 1 MSPS |
| DSP Blocks | — | Up to 25 (18x18 MAC) |
| Tegangan Pemuat | — | 3.3 V or 1.8 V single supply |