10M25DAF484C8G vs 10M25DAF484A7P 比較
詳細並排比較 10M25DAF484C8G 由 Intel 與 10M25DAF484A7P 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | 10M25DAF484C8G | 10M25DAF484A7P |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | MAX 10 | — |
| Logic Elements | 25,000 | 25,000 |
| Embedded Memory (Kbits) | 1638 | — |
| User I/O Count | 360 | — |
| Process Technology | 55 nm CMOS | 55 nm non-volatile |
| Core Supply Voltage (VCCINT) | 1.2 V (1.15 V min / 1.25 V max) | — |
| 封裝 | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-ball Plastic BGA (S-PBGA-B484) |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | 0 °C to 85 °C (Commercial) | — |
| Speed Grade | -8 | A7 |
| Configuration Memory | On-chip dual-configuration flash | — |
| ADC | Integrated 12-bit ADC (where enabled) | — |
| PLLs | Yes (up to 4 analog PLLs per device) | 2 (general-purpose) |
| RoHS 狀態 | Compliant | Compliant |
| MSL 等級 | MSL3 | — |
| Number of I/O Banks | 8 (per F484 pinout) | — |
| Series | — | MAX 10 |
| Configurable Logic Blocks (CLBs) | — | 1,563 |
| Embedded Memory | — | 1,728 Kbits |
| Maximum User I/O | — | 360 |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Temperature Grade | — | Automotive (-40 C to +125 C TJ) |
| Configuration | — | Internal dual-boot flash (no external PROM) |
| On-chip ADC | — | 1 x 12-bit, 1 MSPS |
| DSP Blocks | — | Up to 25 (18x18 MAC) |
| 供應電壓 | — | 3.3 V or 1.8 V single supply |