10M40DAF484C7G vs 10M40DAF672C8G Perbandingan
Perbandingan bersamaan detil 10M40DAF484C7G dari Intel dan 10M40DAF672C8G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M40DAF484C7G | 10M40DAF672C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 FPGA |
| Logic Elements (LE) | 40,000 | — |
| Embedded Memory (bits) | 1,290,240 | 1,290,240 |
| User I/Os | 360 | — |
| DSP Blocks | 4 | — |
| Paket | 484-BGA (FineLine BGA) | 672-ball FBGA (F672) |
| Configuration Memory | Internal flash, dual-image capable | — |
| On-chip ADC | 12-bit, integrated | — |
| Temperature Range | Commercial (C7G suffix) | — |
| Process Node | 55 nm embedded flash | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Moisture Sensitivity (MSL) | [DATA_NEEDED: MSL level] | — |
| Supported Design Tool | Intel Quartus Prime | — |
| Logic Elements | — | 40,000 |
| User Flash (bits) | — | 1,290,240 |
| Maximum User I/O | — | 500 |
| Process Technology | — | 55 nm |
| Core Voltage | — | 1.2 V |
| Configuration Method | — | On-die flash (instant-on) |
| I/O Standards | — | LVDS, LVCMOS, SSTL, HSTL |
| Suhu Kerja | — | 0 C to +85 C (commercial) |
| Level MSL | — | 3 (168 hours) |