10M40DAF484C7G vs 10M40DAF672C8G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M40DAF484C7G disebabkan oleh Intel dan 10M40DAF672C8G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M40DAF484C7G | 10M40DAF672C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 FPGA |
| Logic Elements (LE) | 40,000 | — |
| Embedded Memory (bits) | 1,290,240 | 1,290,240 |
| User I/Os | 360 | — |
| DSP Blocks | 4 | — |
| Kemasan | 484-BGA (FineLine BGA) | 672-ball FBGA (F672) |
| Configuration Memory | Internal flash, dual-image capable | — |
| On-chip ADC | 12-bit, integrated | — |
| Temperature Range | Commercial (C7G suffix) | — |
| Process Node | 55 nm embedded flash | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Moisture Sensitivity (MSL) | [DATA_NEEDED: MSL level] | — |
| Supported Design Tool | Intel Quartus Prime | — |
| Logic Elements | — | 40,000 |
| User Flash (bits) | — | 1,290,240 |
| Maximum User I/O | — | 500 |
| Process Technology | — | 55 nm |
| Core Voltage | — | 1.2 V |
| Configuration Method | — | On-die flash (instant-on) |
| I/O Standards | — | LVDS, LVCMOS, SSTL, HSTL |
| Suhu Operasi | — | 0 C to +85 C (commercial) |
| Aras MSL | — | 3 (168 hours) |