10M40DAF484C7G vs 10M40DAF672C8G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M40DAF484C7G sa pamamagitan ng Intel at 10M40DAF672C8G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M40DAF484C7G | 10M40DAF672C8G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | MAX 10 FPGA |
| Logic Elements (LE) | 40,000 | — |
| Embedded Memory (bits) | 1,290,240 | 1,290,240 |
| User I/Os | 360 | — |
| DSP Blocks | 4 | — |
| Packhaging | 484-BGA (FineLine BGA) | 672-ball FBGA (F672) |
| Configuration Memory | Internal flash, dual-image capable | — |
| On-chip ADC | 12-bit, integrated | — |
| Temperature Range | Commercial (C7G suffix) | — |
| Process Node | 55 nm embedded flash | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Moisture Sensitivity (MSL) | [DATA_NEEDED: MSL level] | — |
| Supported Design Tool | Intel Quartus Prime | — |
| Logic Elements | — | 40,000 |
| User Flash (bits) | — | 1,290,240 |
| Maximum User I/O | — | 500 |
| Process Technology | — | 55 nm |
| Core Voltage | — | 1.2 V |
| Configuration Method | — | On-die flash (instant-on) |
| I/O Standards | — | LVDS, LVCMOS, SSTL, HSTL |
| Temperature na Operasyon | — | 0 C to +85 C (commercial) |
| Level ng MSL | — | 3 (168 hours) |