10M50DAF672I7G vs 10M40DCF672I7G Perbandingan
Perbandingan bersamaan detil 10M50DAF672I7G dari Intel dan 10M40DCF672I7G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M50DAF672I7G | 10M40DCF672I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 | — |
| Logic Elements (LE) | 50,000 | — |
| Embedded Memory (Bits) | 1,677,312 | — |
| Maximum User I/O | 500 | — |
| Jumlah Pin | 672 | — |
| Paket | 672-FBGA (FineLine BGA, 27 mm × 27 mm, 1.0 mm pitch) | 672-ball FBGA (1.0 mm pitch) |
| Process Technology | 55 nm CMOS | — |
| Core Voltage | 1.2 V | — |
| Configuration Memory | Internal Flash (dual-configuration) | On-die flash (non-volatile, dual-image) |
| Multipliers (18×18) | 144 | — |
| PLLs | 4 | 4 |
| Hard Memory Controllers | 2 | — |
| Integrated ADC | Yes (12-bit SAR) | — |
| Suhu Kerja | -40 °C to +100 °C (Industrial, I7G) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | Compliant | — |
| Product Family | — | MAX 10 |
| Logic Elements (LEs) | — | 40,000 |
| Embedded Memory (M9K blocks) | — | 2,500 Kbits |
| Embedded User Flash | — | 1,290,240 bits |
| User I/O Count (max) | — | 500 |
| Multipliers (18x18) | — | 144 |
| Global Clock Networks | — | 16 |
| Process Node | — | 55 nm |
| Core Supply Voltage | — | 1.2 V |
| Rentang Suhu Kerja | — | -40 C to +100 C (industrial) |
| Level MSL | — | 3 |
| Hard Memory Controller | — | DDR3 / LPDDR2 (integrated) |
| On-die ADC | — | Yes (1 MSPS, 12-bit equivalent) |