10M50DAF672I7G vs 10M40DCF672I7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M50DAF672I7G sa pamamagitan ng Intel at 10M40DCF672I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M50DAF672I7G | 10M40DCF672I7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | MAX 10 | — |
| Logic Elements (LE) | 50,000 | — |
| Embedded Memory (Bits) | 1,677,312 | — |
| Maximum User I/O | 500 | — |
| Bilang ng Pins | 672 | — |
| Packhaging | 672-FBGA (FineLine BGA, 27 mm × 27 mm, 1.0 mm pitch) | 672-ball FBGA (1.0 mm pitch) |
| Process Technology | 55 nm CMOS | — |
| Core Voltage | 1.2 V | — |
| Configuration Memory | Internal Flash (dual-configuration) | On-die flash (non-volatile, dual-image) |
| Multipliers (18×18) | 144 | — |
| PLLs | 4 | 4 |
| Hard Memory Controllers | 2 | — |
| Integrated ADC | Yes (12-bit SAR) | — |
| Temperature na Operasyon | -40 °C to +100 °C (Industrial, I7G) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | — |
| Product Family | — | MAX 10 |
| Logic Elements (LEs) | — | 40,000 |
| Embedded Memory (M9K blocks) | — | 2,500 Kbits |
| Embedded User Flash | — | 1,290,240 bits |
| User I/O Count (max) | — | 500 |
| Multipliers (18x18) | — | 144 |
| Global Clock Networks | — | 16 |
| Process Node | — | 55 nm |
| Core Supply Voltage | — | 1.2 V |
| Hanay ng Temperature na Operasyon | — | -40 C to +100 C (industrial) |
| Level ng MSL | — | 3 |
| Hard Memory Controller | — | DDR3 / LPDDR2 (integrated) |
| On-die ADC | — | Yes (1 MSPS, 12-bit equivalent) |