10M50DAF672I7G vs 10M40DCF672I7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50DAF672I7G disebabkan oleh Intel dan 10M40DCF672I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M50DAF672I7G | 10M40DCF672I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 | — |
| Logic Elements (LE) | 50,000 | — |
| Embedded Memory (Bits) | 1,677,312 | — |
| Maximum User I/O | 500 | — |
| Bilangan Pin | 672 | — |
| Kemasan | 672-FBGA (FineLine BGA, 27 mm × 27 mm, 1.0 mm pitch) | 672-ball FBGA (1.0 mm pitch) |
| Process Technology | 55 nm CMOS | — |
| Core Voltage | 1.2 V | — |
| Configuration Memory | Internal Flash (dual-configuration) | On-die flash (non-volatile, dual-image) |
| Multipliers (18×18) | 144 | — |
| PLLs | 4 | 4 |
| Hard Memory Controllers | 2 | — |
| Integrated ADC | Yes (12-bit SAR) | — |
| Suhu Operasi | -40 °C to +100 °C (Industrial, I7G) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant | — |
| Product Family | — | MAX 10 |
| Logic Elements (LEs) | — | 40,000 |
| Embedded Memory (M9K blocks) | — | 2,500 Kbits |
| Embedded User Flash | — | 1,290,240 bits |
| User I/O Count (max) | — | 500 |
| Multipliers (18x18) | — | 144 |
| Global Clock Networks | — | 16 |
| Process Node | — | 55 nm |
| Core Supply Voltage | — | 1.2 V |
| Gambaran Suhu Operasi | — | -40 C to +100 C (industrial) |
| Aras MSL | — | 3 |
| Hard Memory Controller | — | DDR3 / LPDDR2 (integrated) |
| On-die ADC | — | Yes (1 MSPS, 12-bit equivalent) |