5CGXBC9C6F23C7N vs 5CGXBC9A7U19C8N Perbandingan
Perbandingan bersamaan detil 5CGXBC9C6F23C7N dari Intel dan 5CGXBC9A7U19C8N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 5CGXBC9C6F23C7N | 5CGXBC9A7U19C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone V GX | Cyclone V GX |
| Series | 5CGXBC9 (9-series, 6 transceivers) | — |
| Logic Elements | 301,000 | — |
| Embedded Memory | 13,917 Kbit | — |
| Number of GPIO | 224 | — |
| Number of Transceivers | 6 | — |
| Transceiver Data Rate | 3.125 Gbps | — |
| Core Supply Voltage | 1.13 V (typ) | — |
| Process Technology | TSMC 28 nm low-power | — |
| Maximum Operating Frequency | 800 MHz | — |
| Paket | 484-ball FBGA (F23, 23x23 mm) | 484-ball FBGA (UBGA-19) |
| Suhu Kerja | 0 °C to +85 °C (commercial, suffix 7) | 0C to 85C (commercial) |
| Tipe Mounting | Surface Mount (BGA) | — |
| Status RoHS | Compliant | Compliant |
| Tape & Reel Quantity | 60 (per FindIC) | — |
| Tipe Memori | SRAM-based configuration | — |
| Logic Elements (LE) | — | 301,000 |
| Embedded Memory (bits) | — | 14,251,008 |
| DSP Blocks | — | 240 |
| Transceivers | — | 6 channels, up to 3.125 Gbps |
| Hard PCIe Gen2 Blocks | — | Yes |
| User I/O | — | 560 |
| Process Node | — | TSMC 28 nm low-power |
| Speed Grade | — | 8 |
| Configuration Modes | — | JTAG, AS, PS |
| External Memory Support | — | DDR2, DDR3, LPDDR2 |
| Supply Voltage (core) | — | [DATA_NEEDED: core supply voltage] |