5CGXBC9C6F23C7N vs 5CGXBC9A7U19C8N 比較
詳細並排比較 5CGXBC9C6F23C7N 由 Intel 與 5CGXBC9A7U19C8N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | 5CGXBC9C6F23C7N | 5CGXBC9A7U19C8N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Cyclone V GX | Cyclone V GX |
| Series | 5CGXBC9 (9-series, 6 transceivers) | — |
| Logic Elements | 301,000 | — |
| Embedded Memory | 13,917 Kbit | — |
| Number of GPIO | 224 | — |
| Number of Transceivers | 6 | — |
| Transceiver Data Rate | 3.125 Gbps | — |
| Core Supply Voltage | 1.13 V (typ) | — |
| Process Technology | TSMC 28 nm low-power | — |
| Maximum Operating Frequency | 800 MHz | — |
| 封裝 | 484-ball FBGA (F23, 23x23 mm) | 484-ball FBGA (UBGA-19) |
| 工作溫度 | 0 °C to +85 °C (commercial, suffix 7) | 0C to 85C (commercial) |
| 安裝類型 | Surface Mount (BGA) | — |
| RoHS 狀態 | Compliant | Compliant |
| Tape & Reel Quantity | 60 (per FindIC) | — |
| 記憶體類型 | SRAM-based configuration | — |
| Logic Elements (LE) | — | 301,000 |
| Embedded Memory (bits) | — | 14,251,008 |
| DSP Blocks | — | 240 |
| Transceivers | — | 6 channels, up to 3.125 Gbps |
| Hard PCIe Gen2 Blocks | — | Yes |
| User I/O | — | 560 |
| Process Node | — | TSMC 28 nm low-power |
| Speed Grade | — | 8 |
| Configuration Modes | — | JTAG, AS, PS |
| External Memory Support | — | DDR2, DDR3, LPDDR2 |
| Supply Voltage (core) | — | [DATA_NEEDED: core supply voltage] |