ATSAMA5D27C-D5M-CU vs ATSAMA5D22B-CNR Perbandingan
Perbandingan bersamaan detil ATSAMA5D27C-D5M-CU dari Microchip Technology dan ATSAMA5D22B-CNR dari Microchip Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Microchip Technology
ATSAMA5D27C-D5M-CU - 500MHz Cortex-A5 MPU, 512Mb DDR2 SiP | Microchip
ATSAMA5D27C-D5M-CU ✓ AktifMicrochip Technology
ATSAMA5D22B-CNR - 500MHz Cortex-A5 MPU 196-TFBGA | Microchip
ATSAMA5D22B-CNR ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | ATSAMA5D27C-D5M-CU | ATSAMA5D22B-CNR |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Part Status | Active | — |
| Core Processor | ARM Cortex-A5 | — |
| Number of Cores / Bus Width | 1 Core, 32-Bit | — |
| Speed | 500 MHz | — |
| Co-Processors / DSP | ARM NEON, FPU | — |
| RAM Controllers | DDR2/LPDDR2 (integrated 512 Mbit DDR2 SiP) | — |
| Graphics Acceleration | Yes (2D) | — |
| Peripheral Touch Controller | Yes (16-bit databus) | — |
| Audio Subsystem | I2S, class-D amplifier interface | — |
| Ethernet | Dual 10/100 GMAC with 1588 PTP | — |
| USB | USB HSIC + 2x USB 2.0 High-Speed | — |
| CAN | 2x CAN-FD | — |
| Serial Interfaces | 3x FLEXCOM (USART/SPI/TWI), 2x SD/MMC, 1x I2C, 1x SPI, 1x UART | — |
| Image Sensor Interface | Yes | — |
| Suhu Kerja | -40°C to +85°C (Industrial) | -40C to +105C (extended) |
| Paket / Case | 289-LFBGA (14x14 mm, 0.8 mm ball pitch) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Architecture | — | ARM Cortex-A5 (ARMv7-A) |
| Core Count | — | 1 |
| Data Width | — | 32-bit |
| Frekuensi Bawah Maximum | — | 500 MHz |
| Core Supply Voltage | — | 1.2 V |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| L2 Cache | — | 128 KB (configurable as SRAM) |
| NEON Media Processing Engine | — | Yes |
| Floating Point Unit | — | Yes |
| ARM TrustZone | — | Yes |
| Peripheral Touch Controller (PTC) | — | Yes |
| Embedded Audio Subsystem | — | Yes (I2S/TDM) |
| Paket | — | 196-TFBGA (11x11x1.2 mm) |
| Ball Pitch | — | 0.8 mm |
| Packaging | — | Tape & Reel (T&R) |