ATSAMA5D27C-D5M-CU vs ATSAMA5D22B-CNR Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng ATSAMA5D27C-D5M-CU sa pamamagitan ng Microchip Technology at ATSAMA5D22B-CNR sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Microchip Technology
ATSAMA5D27C-D5M-CU ATSAMA5D27C-D5M-CU - 500MHz Cortex-A5 MPU, 512Mb DDR2 SiP | Microchip

ATSAMA5D27C-D5M-CU - 500MHz Cortex-A5 MPU, 512Mb DDR2 SiP | Microchip

ATSAMA5D27C-D5M-CU ✓ Nakahanda
Microchip Technology
ATSAMA5D22B-CNR ATSAMA5D22B-CNR - 500MHz Cortex-A5 MPU 196-TFBGA | Microchip

ATSAMA5D22B-CNR - 500MHz Cortex-A5 MPU 196-TFBGA | Microchip

ATSAMA5D22B-CNR ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro ATSAMA5D27C-D5M-CU ATSAMA5D22B-CNR
Brand Microchip Technology Microchip Technology
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Aktibo Aktibo
Part Status Active —
Core Processor ARM Cortex-A5 —
Number of Cores / Bus Width 1 Core, 32-Bit —
Speed 500 MHz —
Co-Processors / DSP ARM NEON, FPU —
RAM Controllers DDR2/LPDDR2 (integrated 512 Mbit DDR2 SiP) —
Graphics Acceleration Yes (2D) —
Peripheral Touch Controller Yes (16-bit databus) —
Audio Subsystem I2S, class-D amplifier interface —
Ethernet Dual 10/100 GMAC with 1588 PTP —
USB USB HSIC + 2x USB 2.0 High-Speed —
CAN 2x CAN-FD —
Serial Interfaces 3x FLEXCOM (USART/SPI/TWI), 2x SD/MMC, 1x I2C, 1x SPI, 1x UART —
Image Sensor Interface Yes —
Temperature na Operasyon -40°C to +85°C (Industrial) -40C to +105C (extended)
Packhaging / Kaso 289-LFBGA (14x14 mm, 0.8 mm ball pitch) —
Uri ng Pagpapasok Surface Mount Surface Mount
Tindminan RoHS Compliant Compliant
Architecture — ARM Cortex-A5 (ARMv7-A)
Core Count — 1
Data Width — 32-bit
Maksimum na Taktiko ng Oras — 500 MHz
Core Supply Voltage — 1.2 V
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
L2 Cache — 128 KB (configurable as SRAM)
NEON Media Processing Engine — Yes
Floating Point Unit — Yes
ARM TrustZone — Yes
Peripheral Touch Controller (PTC) — Yes
Embedded Audio Subsystem — Yes (I2S/TDM)
Packhaging — 196-TFBGA (11x11x1.2 mm)
Ball Pitch — 0.8 mm
Packaging — Tape & Reel (T&R)

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