DSP56303AG100 vs DSP56303VF100 Perbandingan
Perbandingan bersamaan detil DSP56303AG100 dari NXP Semiconductors dan DSP56303VF100 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
DSP56303AG100 - 24-Bit DSP 100MHz 144-LQFP | NXP Semiconductors
DSP56303AG100 ✗ Akhir Hidup
Perbandingan Spesifikasi
| Parameter Umum | DSP56303AG100 | DSP56303VF100 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | DSP | DSP |
| Status Lingkungan Hidup | Akhir Hidup | Obsolete |
| Core Architecture | DSP56300 family, 24-bit fixed-point | DSP56300 family, 24-bit fixed-point |
| Instruction Word Width | 24-bit | — |
| Data Word Width | 24-bit (56-bit accumulator) | 24 bits |
| Operating Frequency | 100 MHz (100 MIPS) | — |
| On-Chip Program/Data RAM | 24 KB | — |
| On-Chip X/Y Data RAM | 24 KB | — |
| Boot ROM | 576 bytes | — |
| Core Voltage | 1.8 V | [DATA_NEEDED: internal core Vdd] |
| I/O Voltage | 3.3 V | 3.30 V |
| Paket | 144-LQFP (Low-profile Fine-pitch QFP), 20x20 mm | 196-ball LBGA (15x15 mm), MAP-BGA-196 |
| External Memory Bus | 24-bit address / 24-bit data, 16-bit external data bus expansion | — |
| Serial Interfaces | 2x ESSI, 1x SCI, 1x HI08 (Host) | — |
| Timers | Triple Timer module (3x 16-bit) | — |
| Address Generation | 24-bit ALU with bit-reversed addressing for FFT | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Rentang Suhu Kerja | -40C to +85C (industrial) | — |
| Level MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: moisture sensitivity level] |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance per datasheet] |
| Clock Frequency | — | 100 MHz |
| Performance | — | 100 MIPS (million instructions per second) |
| Instruction Cycle | — | Single clock cycle per instruction |
| Address Space | — | 24-bit program and data |
| On-Chip RAM | — | 24 KB |
| Bootstrap ROM | — | 576 bytes |
| Interfaces | — | Host Interface (HI08), ESSI, SCI |
| On-Chip Peripherals | — | Triple Timer, PLL, External Memory Expansion port |
| Debug | — | JTAG/OnCE |
| Packaging | — | Tray |
| Suhu Kerja | — | [DATA_NEEDED: industrial temperature grade] |