EP20K600CF672 vs EP20K600CF672C8N Perbandingan
Perbandingan bersamaan detil EP20K600CF672 dari Intel dan EP20K600CF672C8N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
EP20K600CF672 [data_needed: lifecycle status]
Perbandingan Spesifikasi
| Parameter Umum | EP20K600CF672 | EP20K600CF672C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | [DATA NEEDED: Lifecycle Status] | Aktif |
| Product Type | Field-Programmable Gate Array (FPGA) | FPGA / programmable logic device |
| Product Family | APEX-20KC | — |
| Manufacturer | Altera / Intel | — |
| User I/O Lines | 508 I/O | — |
| Logic Elements | [DATA_NEEDED: logic element count] | — |
| Propagation Delay | 1.48 ns for supplied EP20K600CF672C9N/C8N references | 1.48 ns |
| Device Type Listed by Supplied References | SPLD | — |
| Process Technology | 0.15 um all-layer copper-metal process for supplied family references | — |
| Performance Claim | Up to 35% faster than APEX 20KE devices | — |
| Package Type | 672-ball BGA, FCBGA | — |
| Package Dimensions | 45 mm x 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Tipe Mounting | Surface Mount | Surface mount |
| Suhu Kerja | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references | 0°C to 85°C |
| Configuration Device Type | Enhanced Configuration (EPC) device | — |
| Core Voltage | [DATA_NEEDED: core supply voltage] | — |
| I/O Voltage | [DATA_NEEDED: I/O supply voltage] | — |
| Configuration Memory | [DATA_NEEDED: configuration memory type and capacity] | — |
| Embedded Memory | [DATA_NEEDED: embedded memory capacity] | — |
| Status RoHS | unknown | unknown |
| REACH Status | unknown | unknown |
| AEC-Q100 Status | unknown | — |
| Device Type | — | SPLD |
| Family | — | APEX 20KC |
| Nominal Gate Capacity | — | 600K gates |
| Logic Elements or Cells | — | 24,320 |
| Macros | — | 2,432 |
| User I/O Count | — | 508 |
| Package Terminals | — | 652 pins |
| Paket | — | BGA-652, 45 x 45 mm, 1.27 mm pitch |
| Package Description | — | 672-pin FC-FBGA |
| Tegangan Pemuat | — | 1.8 V |
| Listed Frequency | — | 301.21 MHz |
| Fabrication Process | — | 0.15 µm |
| Interconnect Metal | — | All-layer copper metal |
| I/O Configuration | — | 508 user I/O |
| AEC-Q100 Qualification | — | unknown |
| Configuration Method | — | [DATA_NEEDED: configuration memory and programming method] |
| Core Current | — | [DATA_NEEDED: core supply current] |
| I/O Bank Voltage | — | [DATA_NEEDED: supported I/O voltage range] |
| Junction Temperature | — | [DATA_NEEDED: maximum junction temperature] |
| Tahanan Panas | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |