EP20K600CF672 vs EP20K600CF672C8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP20K600CF672 disebabkan oleh Intel dan EP20K600CF672C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
EP20K600CF672 [data_needed: lifecycle status]
Pengandingan Spesifikasi
| Parametr | EP20K600CF672 | EP20K600CF672C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | [DATA NEEDED: Lifecycle Status] | Aktif |
| Product Type | Field-Programmable Gate Array (FPGA) | FPGA / programmable logic device |
| Product Family | APEX-20KC | — |
| Manufacturer | Altera / Intel | — |
| User I/O Lines | 508 I/O | — |
| Logic Elements | [DATA_NEEDED: logic element count] | — |
| Propagation Delay | 1.48 ns for supplied EP20K600CF672C9N/C8N references | 1.48 ns |
| Device Type Listed by Supplied References | SPLD | — |
| Process Technology | 0.15 um all-layer copper-metal process for supplied family references | — |
| Performance Claim | Up to 35% faster than APEX 20KE devices | — |
| Package Type | 672-ball BGA, FCBGA | — |
| Package Dimensions | 45 mm x 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Jenis Pemasangan | Surface Mount | Surface mount |
| Suhu Operasi | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references | 0°C to 85°C |
| Configuration Device Type | Enhanced Configuration (EPC) device | — |
| Core Voltage | [DATA_NEEDED: core supply voltage] | — |
| I/O Voltage | [DATA_NEEDED: I/O supply voltage] | — |
| Configuration Memory | [DATA_NEEDED: configuration memory type and capacity] | — |
| Embedded Memory | [DATA_NEEDED: embedded memory capacity] | — |
| Status RoHS | unknown | unknown |
| REACH Status | unknown | unknown |
| AEC-Q100 Status | unknown | — |
| Device Type | — | SPLD |
| Family | — | APEX 20KC |
| Nominal Gate Capacity | — | 600K gates |
| Logic Elements or Cells | — | 24,320 |
| Macros | — | 2,432 |
| User I/O Count | — | 508 |
| Package Terminals | — | 652 pins |
| Kemasan | — | BGA-652, 45 x 45 mm, 1.27 mm pitch |
| Package Description | — | 672-pin FC-FBGA |
| Tegangan Pemberi Arus | — | 1.8 V |
| Listed Frequency | — | 301.21 MHz |
| Fabrication Process | — | 0.15 µm |
| Interconnect Metal | — | All-layer copper metal |
| I/O Configuration | — | 508 user I/O |
| AEC-Q100 Qualification | — | unknown |
| Configuration Method | — | [DATA_NEEDED: configuration memory and programming method] |
| Core Current | — | [DATA_NEEDED: core supply current] |
| I/O Bank Voltage | — | [DATA_NEEDED: supported I/O voltage range] |
| Junction Temperature | — | [DATA_NEEDED: maximum junction temperature] |
| Tegangan Panas | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |