EP2A15F672C7N vs EP2A25F672C8N Perbandingan
Perbandingan bersamaan detil EP2A15F672C7N dari Intel dan EP2A25F672C8N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2A15F672C7N | EP2A25F672C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Family | APEX II | APEX II |
| Logic Elements (Cells) | 16,640 | — |
| Embedded Memory Bits | 425,984 | — |
| User I/Os | 492 | 492 |
| Process Technology | 0.15 µm all-layer copper CMOS | — |
| Metal Layers | Up to 8 | — |
| Core Voltage | 1.5 V | — |
| Maximum Internal Frequency | 500 MHz | 333 MHz |
| Speed Grade | -7 | C8 |
| Paket | 672-ball FC-FBGA (FineLine BGA) | 672-ball FC-FBGA (FineLine BGA) |
| Suhu Kerja | Commercial (0C to +85C) | 0 C to 85 C (commercial) |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL | — |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) | — |
| Configuration Methods | JTAG, Passive Serial | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Technology Node | — | 0.15 um all-layer copper process |
| System Gates | — | 900,000 |
| Logic Elements / Cells | — | 24,320 |
| Propagation Delay | — | 1.69 ns |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Core Supply Voltage | — | 1.5 V |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |