EP2A15F672C7N vs EP2A25F672C8N 比較
詳細並排比較 EP2A15F672C7N 由 Intel 與 EP2A25F672C8N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2A15F672C7N | EP2A25F672C8N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | NRND |
| Family | APEX II | APEX II |
| Logic Elements (Cells) | 16,640 | — |
| Embedded Memory Bits | 425,984 | — |
| User I/Os | 492 | 492 |
| Process Technology | 0.15 µm all-layer copper CMOS | — |
| Metal Layers | Up to 8 | — |
| Core Voltage | 1.5 V | — |
| Maximum Internal Frequency | 500 MHz | 333 MHz |
| Speed Grade | -7 | C8 |
| 封裝 | 672-ball FC-FBGA (FineLine BGA) | 672-ball FC-FBGA (FineLine BGA) |
| 工作溫度 | Commercial (0C to +85C) | 0 C to 85 C (commercial) |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL | — |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) | — |
| Configuration Methods | JTAG, Passive Serial | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant |
| Technology Node | — | 0.15 um all-layer copper process |
| System Gates | — | 900,000 |
| Logic Elements / Cells | — | 24,320 |
| Propagation Delay | — | 1.69 ns |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Core Supply Voltage | — | 1.5 V |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |