EP2A25F672C9ES vs EP2A25F672C8N Perbandingan
Perbandingan bersamaan detil EP2A25F672C9ES dari Intel dan EP2A25F672C8N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2A25F672C9ES | EP2A25F672C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | NRND |
| Family | APEX II | APEX II |
| Logic Elements | 24,320 | — |
| System Gates | 900,000 | 900,000 |
| Maximum Operating Frequency | 236 MHz | — |
| Propagation Delay | 1.69 ns | 1.69 ns |
| Process Technology | 0.15 µm CMOS (up to 8 metal layers, all-layer copper) | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| User I/Os | 492 | 492 |
| Paket | 672-pin FC-FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch | 672-ball FC-FBGA (FineLine BGA) |
| Speed Grade | -9 | C8 |
| Configuration Class | ES (Enhanced) | — |
| Suhu Kerja | 0 °C to 85 °C (Commercial) | 0 C to 85 C (commercial) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Level MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Logic Family | CMOS | — |
| Technology Node | — | 0.15 um all-layer copper process |
| Logic Elements / Cells | — | 24,320 |
| Maximum Internal Frequency | — | 333 MHz |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |