EP2A25F672C9ES vs EP2A25F672C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F672C9ES sa pamamagitan ng Intel at EP2A25F672C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A25F672C9ES | EP2A25F672C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | APEX II | APEX II |
| Logic Elements | 24,320 | — |
| System Gates | 900,000 | 900,000 |
| Maximum Operating Frequency | 236 MHz | — |
| Propagation Delay | 1.69 ns | 1.69 ns |
| Process Technology | 0.15 µm CMOS (up to 8 metal layers, all-layer copper) | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| User I/Os | 492 | 492 |
| Packhaging | 672-pin FC-FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch | 672-ball FC-FBGA (FineLine BGA) |
| Speed Grade | -9 | C8 |
| Configuration Class | ES (Enhanced) | — |
| Temperature na Operasyon | 0 °C to 85 °C (Commercial) | 0 C to 85 C (commercial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Level ng MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Logic Family | CMOS | — |
| Technology Node | — | 0.15 um all-layer copper process |
| Logic Elements / Cells | — | 24,320 |
| Maximum Internal Frequency | — | 333 MHz |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |