EP2AGX190FF35I5 vs EP2AGX190FF35I3G Perbandingan

Perbandingan bersamaan detil EP2AGX190FF35I5 dari Intel dan EP2AGX190FF35I3G dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Altera
EP2AGX190FF35I3G EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera

EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera

EP2AGX190FF35I3G ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP2AGX190FF35I5 EP2AGX190FF35I3G
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Waktu Pembelian Terakhir
Family Arria II GX Arria II GX
Logic Elements (LE) 181165 181,165
Embedded Memory Bits 10177536 —
User I/O Count 612 —
Process Technology 40 nm —
Core Voltage 0.9 V 0.9 V
Paket 1152-ball FC-FBGA (Flip-Chip BGA) 1152-ball FC-FBGA (FF35), 35 mm body
Speed Grade 5 (slowest in family, lower power) 3
Operating Temperature Grade Industrial (-40 C to +100 C ambient) —
Maximum User Frequency 500 MHz —
DSP Blocks [DATA_NEEDED: DSP block count and 18x18 multiplier count] —
Transceiver Count [DATA_NEEDED: number of multi-gigabit transceivers] —
Transceiver Data Rate [DATA_NEEDED: max Gbps per channel] —
PCIe Hard IP PCIe Gen1/Gen2 hard IP blocks (per family feature) —
Configuration Memory SRAM-based, supports EPCS serial Flash loaders —
Tipe Mounting Surface Mount (BGA, reflow soldering required) Surface Mount (flip-chip BGA)
Status RoHS Compliant (per Intel product page) Compliant (suffix G)
Lead-Free Yes (per Intel product page) Yes
Level MSL [DATA_NEEDED: Moisture Sensitivity Level] —
Adaptive Logic Modules (ALM) — [DATA_NEEDED: ALM count]
User I/O Pins — 612
Embedded Memory (bits) — 10,177,536
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Transceivers — 8 high-speed transceiver channels (multi-gigabit)
Embedded Multipliers — [DATA_NEEDED: 18x18 multiplier count]
PLLs — [DATA_NEEDED: PLL count]
I/O Voltage Standards — 1.2 V to 3.3 V (LVTTL, LVCMOS, LVDS, HSTL, SSTL)
Process Node — 40 nm
Suhu Kerja — -40 °C to +100 °C (industrial, suffix I)
Ball Pitch — [DATA_NEEDED: 1.0 mm (typical for FF35)]
Programming Toolchain — Quartus II / Quartus Prime

Spek dan Sumber

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