EP2AGX190FF35I5 vs EP2AGX190FF35I3G Karşılaştırma

Ayrıntılı yan yana karşılaştırma EP2AGX190FF35I5 tarafından Intel ve EP2AGX190FF35I3G tarafından AlteraAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

Altera
EP2AGX190FF35I3G EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera

EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera

EP2AGX190FF35I3G ⚠ Son Satın Alma

Özellik Karşılaştırması

Parametre EP2AGX190FF35I5 EP2AGX190FF35I3G
Marka Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Yaşam Döngüsü Durumu Aktif Son Alış Zamanı
Family Arria II GX Arria II GX
Logic Elements (LE) 181165 181,165
Embedded Memory Bits 10177536 —
User I/O Count 612 —
Process Technology 40 nm —
Core Voltage 0.9 V 0.9 V
Paket 1152-ball FC-FBGA (Flip-Chip BGA) 1152-ball FC-FBGA (FF35), 35 mm body
Speed Grade 5 (slowest in family, lower power) 3
Operating Temperature Grade Industrial (-40 C to +100 C ambient) —
Maximum User Frequency 500 MHz —
DSP Blocks [DATA_NEEDED: DSP block count and 18x18 multiplier count] —
Transceiver Count [DATA_NEEDED: number of multi-gigabit transceivers] —
Transceiver Data Rate [DATA_NEEDED: max Gbps per channel] —
PCIe Hard IP PCIe Gen1/Gen2 hard IP blocks (per family feature) —
Configuration Memory SRAM-based, supports EPCS serial Flash loaders —
Montaj Türü Surface Mount (BGA, reflow soldering required) Surface Mount (flip-chip BGA)
RoHS Durumu Compliant (per Intel product page) Compliant (suffix G)
Lead-Free Yes (per Intel product page) Yes
MSL Seviyesi [DATA_NEEDED: Moisture Sensitivity Level] —
Adaptive Logic Modules (ALM) — [DATA_NEEDED: ALM count]
User I/O Pins — 612
Embedded Memory (bits) — 10,177,536
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Transceivers — 8 high-speed transceiver channels (multi-gigabit)
Embedded Multipliers — [DATA_NEEDED: 18x18 multiplier count]
PLLs — [DATA_NEEDED: PLL count]
I/O Voltage Standards — 1.2 V to 3.3 V (LVTTL, LVCMOS, LVDS, HSTL, SSTL)
Process Node — 40 nm
İşletim Sıcaklığı — -40 °C to +100 °C (industrial, suffix I)
Ball Pitch — [DATA_NEEDED: 1.0 mm (typical for FF35)]
Programming Toolchain — Quartus II / Quartus Prime

Dökümanlar & Kaynaklar

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