EP2AGX260EF29C5G vs EP2AGX260EF29C6N Perbandingan
Perbandingan bersamaan detil EP2AGX260EF29C5G dari Intel dan EP2AGX260EF29C6N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGX260EF29C5G | EP2AGX260EF29C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Arria II GX | — |
| Logic Elements (LE) | 260,000 | — |
| Total Memory Bits | 12,038,144 bits | 12038144 |
| Embedded RAM Bits | 244,188 bits | — |
| Number of LABs | 10,260 | — |
| User I/O Count | 372 | — |
| Paket | 780-ball FBGA (FineLine BGA) | — |
| Package Code | HBGA, 29 mm | — |
| Speed Grade | C5 (commercial -5C to 85C) | — |
| Process Node | 40 nm | — |
| Supply Voltage - Core | [DATA_NEEDED: VCCINT nominal] | — |
| Transceivers | Multi-gigabit transceivers (MGTs), count [DATA_NEEDED] | Up to 16 GXB channels at 6.375 Gbps |
| DSP Blocks | 18x18 multipliers, count [DATA_NEEDED] | — |
| Suhu Kerja | 0C to 85C (commercial) | 0C to +85C (commercial, C6 speed grade) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (G suffix) | — |
| Level MSL | [DATA_NEEDED] | 3 |
| Series | — | Arria II GX |
| Logic Elements | — | 244188 |
| Number of LABs/CLBs | — | 10260 |
| Number of I/O | — | 372 |
| Voltage - Supply | — | 0.9 V core |
| Paket / Case | — | 780-BBGA, FCBGA (29 x 29 mm) |
| Lead Free | — | Yes |
| JEDEC Standard | — | MS-034 |
| Process Technology | — | 40 nm CMOS |
| Maximum Operating Frequency | — | 500 MHz |
| Tipe Memori | — | M9K + MLAB (mixed) |
| Hard IP | — | PCIe Gen2 x1/x2/x4, DDR3 PHY |
| Supplier Device Package | — | 780-FBGA (FC-FBGA) |