EP2AGX260EF29C5G vs EP2AGX260EF29C6N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX260EF29C5G disebabkan oleh Intel dan EP2AGX260EF29C6N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGX260EF29C5G | EP2AGX260EF29C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Arria II GX | — |
| Logic Elements (LE) | 260,000 | — |
| Total Memory Bits | 12,038,144 bits | 12038144 |
| Embedded RAM Bits | 244,188 bits | — |
| Number of LABs | 10,260 | — |
| User I/O Count | 372 | — |
| Kemasan | 780-ball FBGA (FineLine BGA) | — |
| Package Code | HBGA, 29 mm | — |
| Speed Grade | C5 (commercial -5C to 85C) | — |
| Process Node | 40 nm | — |
| Supply Voltage - Core | [DATA_NEEDED: VCCINT nominal] | — |
| Transceivers | Multi-gigabit transceivers (MGTs), count [DATA_NEEDED] | Up to 16 GXB channels at 6.375 Gbps |
| DSP Blocks | 18x18 multipliers, count [DATA_NEEDED] | — |
| Suhu Operasi | 0C to 85C (commercial) | 0C to +85C (commercial, C6 speed grade) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (G suffix) | — |
| Aras MSL | [DATA_NEEDED] | 3 |
| Series | — | Arria II GX |
| Logic Elements | — | 244188 |
| Number of LABs/CLBs | — | 10260 |
| Number of I/O | — | 372 |
| Voltage - Supply | — | 0.9 V core |
| Kemasan / Case | — | 780-BBGA, FCBGA (29 x 29 mm) |
| Lead Free | — | Yes |
| JEDEC Standard | — | MS-034 |
| Process Technology | — | 40 nm CMOS |
| Maximum Operating Frequency | — | 500 MHz |
| Jenis Ingatan | — | M9K + MLAB (mixed) |
| Hard IP | — | PCIe Gen2 x1/x2/x4, DDR3 PHY |
| Supplier Device Package | — | 780-FBGA (FC-FBGA) |