EP2AGX65DF29C6 vs EP2AGX65DF29I3N Perbandingan
Perbandingan bersamaan detil EP2AGX65DF29C6 dari Intel dan EP2AGX65DF29I3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGX65DF29C6 | EP2AGX65DF29I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Arria II GX | Intel FPGA (formerly Altera Arria II GX) |
| Logic Elements (LE) | 60,214 | 60214 |
| Logic Array Blocks (LABs) | 2,530 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 5,371,904 | 5371904 |
| Maximum User I/O | 364 | — |
| DSP Blocks (18x18 Multipliers) | [DATA_NEEDED: DSP block count] | — |
| Transceivers | 8 (up to 3.75 Gbps per Arria II GX family spec) | Up to 8 multi-gigabit transceivers, up to 3.75 Gbps |
| PLLs | 4 | — |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm | — |
| Speed Grade | 6 (C6) | -3 |
| Suhu Kerja | Commercial (0C to +85C) | -40 C to +100 C (Industrial) |
| Paket | 780-ball FC-FBGA (29x29 mm) | 780-BBGA, FCBGA (FBGA-780, 29 x 29 mm, 1.0 mm pitch) |
| Tipe Mounting | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Status RoHS | Compliant | Compliant (Pb-free N suffix) |
| Series | — | Arria II GX |
| Process Node | — | 40 nm TSMC low-power |
| Number of LABs/CLBs | — | 2530 |
| Total RAM Bits | — | 5,371,904 |
| User I/O Count | — | 364 |
| Operating Frequency (max) | — | 500 MHz |
| Configuration Method | — | JTAG, Active Serial, Passive Serial, Fast Passive Parallel |