EP2AGX65DF29C6 vs EP2AGX65DF29I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX65DF29C6 sa pamamagitan ng Intel at EP2AGX65DF29I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGX65DF29C6 - Arria II GX FPGA, 60K LE, 364 I/O, 780-FCBGA | Intel
EP2AGX65DF29C6 ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | EP2AGX65DF29C6 | EP2AGX65DF29I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Arria II GX | Intel FPGA (formerly Altera Arria II GX) |
| Logic Elements (LE) | 60,214 | 60214 |
| Logic Array Blocks (LABs) | 2,530 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 5,371,904 | 5371904 |
| Maximum User I/O | 364 | — |
| DSP Blocks (18x18 Multipliers) | [DATA_NEEDED: DSP block count] | — |
| Transceivers | 8 (up to 3.75 Gbps per Arria II GX family spec) | Up to 8 multi-gigabit transceivers, up to 3.75 Gbps |
| PLLs | 4 | — |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm | — |
| Speed Grade | 6 (C6) | -3 |
| Temperature na Operasyon | Commercial (0C to +85C) | -40 C to +100 C (Industrial) |
| Packhaging | 780-ball FC-FBGA (29x29 mm) | 780-BBGA, FCBGA (FBGA-780, 29 x 29 mm, 1.0 mm pitch) |
| Uri ng Pagpapasok | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Tindminan RoHS | Compliant | Compliant (Pb-free N suffix) |
| Series | — | Arria II GX |
| Process Node | — | 40 nm TSMC low-power |
| Number of LABs/CLBs | — | 2530 |
| Total RAM Bits | — | 5,371,904 |
| User I/O Count | — | 364 |
| Operating Frequency (max) | — | 500 MHz |
| Configuration Method | — | JTAG, Active Serial, Passive Serial, Fast Passive Parallel |