EP2AGX65DF29C6 vs EP2AGX65DF29I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX65DF29C6 disebabkan oleh Intel dan EP2AGX65DF29I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGX65DF29C6 | EP2AGX65DF29I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Arria II GX | Intel FPGA (formerly Altera Arria II GX) |
| Logic Elements (LE) | 60,214 | 60214 |
| Logic Array Blocks (LABs) | 2,530 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 5,371,904 | 5371904 |
| Maximum User I/O | 364 | — |
| DSP Blocks (18x18 Multipliers) | [DATA_NEEDED: DSP block count] | — |
| Transceivers | 8 (up to 3.75 Gbps per Arria II GX family spec) | Up to 8 multi-gigabit transceivers, up to 3.75 Gbps |
| PLLs | 4 | — |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm | — |
| Speed Grade | 6 (C6) | -3 |
| Suhu Operasi | Commercial (0C to +85C) | -40 C to +100 C (Industrial) |
| Kemasan | 780-ball FC-FBGA (29x29 mm) | 780-BBGA, FCBGA (FBGA-780, 29 x 29 mm, 1.0 mm pitch) |
| Jenis Pemasangan | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Status RoHS | Compliant | Compliant (Pb-free N suffix) |
| Series | — | Arria II GX |
| Process Node | — | 40 nm TSMC low-power |
| Number of LABs/CLBs | — | 2530 |
| Total RAM Bits | — | 5,371,904 |
| User I/O Count | — | 364 |
| Operating Frequency (max) | — | 500 MHz |
| Configuration Method | — | JTAG, Active Serial, Passive Serial, Fast Passive Parallel |