EP2AGX95DF25C6G vs EP2AGX95DF25I3G Perbandingan
Perbandingan bersamaan detil EP2AGX95DF25C6G dari Intel dan EP2AGX95DF25I3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGX95DF25C6G | EP2AGX95DF25I3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 89,178 | — |
| Adaptive Logic Modules (ALM) | 35,600 (estimated) | — |
| Embedded Memory Bits | 6,839,296 bits | 6,839,296 |
| Embedded Memory Type | M9K + M144K blocks | — |
| DSP Blocks | Variable-precision (estimated 88 to 176) | — |
| User I/O | 260 | — |
| Transceivers | Up to 12 channels | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Hard Memory Controller | Yes (DDR3, DDR2, QDRII+) | — |
| PLL | Up to 8 (per family datasheet) | — |
| Process Node | 40 nm | — |
| Paket | 572-ball FCBGA, 25x25 mm | 572-ball FCBGA |
| Speed Grade | -6 (fastest commercial) | I3 |
| Suhu Kerja | 0C to 85C (commercial, junction) | -40C to +100C |
| Configuration Modes | AS, AP, FPP, PS, JTAG | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 89,178 |
| User I/O Count | — | 260 |
| Temperature Grade | — | Industrial |
| Tipe Mounting | — | Surface Mount (Flip-Chip BGA) |
| Lead-Free | — | Yes |
| Level MSL | — | [DATA_NEEDED: MSL level] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count per speed grade] |
| Maximum User I/O Voltage | — | [DATA_NEEDED: I/O bank supply range] |
| Configuration Method | — | Serial/Parallel via Altera Quartus II |