EP2AGX95DF25C6G vs EP2AGX95DF25I3G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX95DF25C6G disebabkan oleh Intel dan EP2AGX95DF25I3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGX95DF25C6G | EP2AGX95DF25I3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 89,178 | — |
| Adaptive Logic Modules (ALM) | 35,600 (estimated) | — |
| Embedded Memory Bits | 6,839,296 bits | 6,839,296 |
| Embedded Memory Type | M9K + M144K blocks | — |
| DSP Blocks | Variable-precision (estimated 88 to 176) | — |
| User I/O | 260 | — |
| Transceivers | Up to 12 channels | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Hard Memory Controller | Yes (DDR3, DDR2, QDRII+) | — |
| PLL | Up to 8 (per family datasheet) | — |
| Process Node | 40 nm | — |
| Kemasan | 572-ball FCBGA, 25x25 mm | 572-ball FCBGA |
| Speed Grade | -6 (fastest commercial) | I3 |
| Suhu Operasi | 0C to 85C (commercial, junction) | -40C to +100C |
| Configuration Modes | AS, AP, FPP, PS, JTAG | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 89,178 |
| User I/O Count | — | 260 |
| Temperature Grade | — | Industrial |
| Jenis Pemasangan | — | Surface Mount (Flip-Chip BGA) |
| Lead-Free | — | Yes |
| Aras MSL | — | [DATA_NEEDED: MSL level] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count per speed grade] |
| Maximum User I/O Voltage | — | [DATA_NEEDED: I/O bank supply range] |
| Configuration Method | — | Serial/Parallel via Altera Quartus II |