EP2AGX95DF25C6G vs EP2AGX95DF25I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX95DF25C6G sa pamamagitan ng Intel at EP2AGX95DF25I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX95DF25C6G | EP2AGX95DF25I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 89,178 | — |
| Adaptive Logic Modules (ALM) | 35,600 (estimated) | — |
| Embedded Memory Bits | 6,839,296 bits | 6,839,296 |
| Embedded Memory Type | M9K + M144K blocks | — |
| DSP Blocks | Variable-precision (estimated 88 to 176) | — |
| User I/O | 260 | — |
| Transceivers | Up to 12 channels | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Hard Memory Controller | Yes (DDR3, DDR2, QDRII+) | — |
| PLL | Up to 8 (per family datasheet) | — |
| Process Node | 40 nm | — |
| Packhaging | 572-ball FCBGA, 25x25 mm | 572-ball FCBGA |
| Speed Grade | -6 (fastest commercial) | I3 |
| Temperature na Operasyon | 0C to 85C (commercial, junction) | -40C to +100C |
| Configuration Modes | AS, AP, FPP, PS, JTAG | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements | — | 89,178 |
| User I/O Count | — | 260 |
| Temperature Grade | — | Industrial |
| Uri ng Pagpapasok | — | Surface Mount (Flip-Chip BGA) |
| Lead-Free | — | Yes |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count per speed grade] |
| Maximum User I/O Voltage | — | [DATA_NEEDED: I/O bank supply range] |
| Configuration Method | — | Serial/Parallel via Altera Quartus II |