EP2AGZ300FH29C3N vs EP2AGZ300FH29I4G Perbandingan
Perbandingan bersamaan detil EP2AGZ300FH29C3N dari Altera dan EP2AGZ300FH29I4G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGZ300FH29C3N | EP2AGZ300FH29I4G |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GZ | Arria II GZ (AGZ) |
| Logic Elements (LE) | 298000 | 300,000 (approx., per family member) |
| Logic Array Blocks (LABs) | 11920 | — |
| Embedded Memory Bits | 18854912 | — |
| User I/O Pins | 281 | — |
| Paket | 780-BBGA, FCBGA | — |
| Process Technology | 40 nm CMOS | — |
| Core Voltage | 0.9 V | — |
| Speed Grade | -3 | I4 |
| Temperature Grade | Commercial (0 C to +85 C) | — |
| Transceivers | 12 channels up to 6.375 Gbps | Embedded multi-gigabit transceivers (per family) |
| Embedded Multipliers (18x18) | 736 | — |
| PLLs | 8 | — |
| Global Clock Networks | 16 | — |
| PCIe Hard IP | PCI Express Gen2 (x1/x4/x8) | — |
| Memory Controller Hard IP | DDR3 SDRAM | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes (N suffix) | Yes (per RoHS) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Modes | AS, PS, JTAG | — |
| Number of I/O | — | 281 |
| Package Type | — | 780-ball Flip-Chip BGA (FineLine) |
| Package Code | — | FH29 (29x29 mm) |
| Rentang Suhu Kerja | — | -40C to +100C (industrial, I-grade) |
| Process Node | — | 40 nm TSMC |
| Supply Voltage (Core) | — | 0.9 V (typical) |
| Configuration Method | — | JTAG / Passive Serial / Fast Passive Parallel |
| DSP Blocks | — | Yes (variable-precision, per family) |
| Block RAM | — | Embedded M9K / M144K blocks |
| Level MSL | — | [DATA_NEEDED: MSL rating] |