EP2AGZ300FH29C3N vs EP2AGZ300FH29I4G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FH29C3N sa pamamagitan ng Altera at EP2AGZ300FH29I4G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ300FH29C3N | EP2AGZ300FH29I4G |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GZ | Arria II GZ (AGZ) |
| Logic Elements (LE) | 298000 | 300,000 (approx., per family member) |
| Logic Array Blocks (LABs) | 11920 | — |
| Embedded Memory Bits | 18854912 | — |
| User I/O Pins | 281 | — |
| Packhaging | 780-BBGA, FCBGA | — |
| Process Technology | 40 nm CMOS | — |
| Core Voltage | 0.9 V | — |
| Speed Grade | -3 | I4 |
| Temperature Grade | Commercial (0 C to +85 C) | — |
| Transceivers | 12 channels up to 6.375 Gbps | Embedded multi-gigabit transceivers (per family) |
| Embedded Multipliers (18x18) | 736 | — |
| PLLs | 8 | — |
| Global Clock Networks | 16 | — |
| PCIe Hard IP | PCI Express Gen2 (x1/x4/x8) | — |
| Memory Controller Hard IP | DDR3 SDRAM | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes (N suffix) | Yes (per RoHS) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Modes | AS, PS, JTAG | — |
| Number of I/O | — | 281 |
| Package Type | — | 780-ball Flip-Chip BGA (FineLine) |
| Package Code | — | FH29 (29x29 mm) |
| Hanay ng Temperature na Operasyon | — | -40C to +100C (industrial, I-grade) |
| Process Node | — | 40 nm TSMC |
| Supply Voltage (Core) | — | 0.9 V (typical) |
| Configuration Method | — | JTAG / Passive Serial / Fast Passive Parallel |
| DSP Blocks | — | Yes (variable-precision, per family) |
| Block RAM | — | Embedded M9K / M144K blocks |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |