EP2AGZ300FH29C3N vs EP2AGZ300FH29I4G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ300FH29C3N disebabkan oleh Altera dan EP2AGZ300FH29I4G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ300FH29C3N | EP2AGZ300FH29I4G |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GZ | Arria II GZ (AGZ) |
| Logic Elements (LE) | 298000 | 300,000 (approx., per family member) |
| Logic Array Blocks (LABs) | 11920 | — |
| Embedded Memory Bits | 18854912 | — |
| User I/O Pins | 281 | — |
| Kemasan | 780-BBGA, FCBGA | — |
| Process Technology | 40 nm CMOS | — |
| Core Voltage | 0.9 V | — |
| Speed Grade | -3 | I4 |
| Temperature Grade | Commercial (0 C to +85 C) | — |
| Transceivers | 12 channels up to 6.375 Gbps | Embedded multi-gigabit transceivers (per family) |
| Embedded Multipliers (18x18) | 736 | — |
| PLLs | 8 | — |
| Global Clock Networks | 16 | — |
| PCIe Hard IP | PCI Express Gen2 (x1/x4/x8) | — |
| Memory Controller Hard IP | DDR3 SDRAM | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes (N suffix) | Yes (per RoHS) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Modes | AS, PS, JTAG | — |
| Number of I/O | — | 281 |
| Package Type | — | 780-ball Flip-Chip BGA (FineLine) |
| Package Code | — | FH29 (29x29 mm) |
| Gambaran Suhu Operasi | — | -40C to +100C (industrial, I-grade) |
| Process Node | — | 40 nm TSMC |
| Supply Voltage (Core) | — | 0.9 V (typical) |
| Configuration Method | — | JTAG / Passive Serial / Fast Passive Parallel |
| DSP Blocks | — | Yes (variable-precision, per family) |
| Block RAM | — | Embedded M9K / M144K blocks |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |