EP2C70F672C6N vs EP2C70F672C7N Perbandingan
Perbandingan bersamaan detil EP2C70F672C6N dari Intel dan EP2C70F672C7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2C70F672C6N | EP2C70F672C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Cyclone II | Cyclone II |
| Series | EP2C70 | — |
| Logic Elements | 68,416 | — |
| Logic Array Blocks (LABs) | 4,276 | — |
| Total RAM Bits | 1,152,000 | — |
| Embedded 18x18 Multipliers | 150 | — |
| PLLs | 4 | 4 |
| Maximum User I/O | 422 | 422 |
| I/O Banks | 8 | — |
| Paket | 672-ball FBGA, 27x27 mm, 1.0 mm pitch | 672-BGA (FBGA-672) |
| Speed Grade | C6 | C7 (slower, lower-power variant) |
| Suhu Kerja | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| Process Technology | 90 nm low-k CMOS, copper interconnect | 90 nm CMOS |
| Configuration Memory | SRAM (volatile) | — |
| Configuration Schemes | AS, AP, PS, JTAG | — |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Lead-free (per FBGA marking) | Compliant (lead-free FBGA) |
| Logic Elements (LE) | — | 68,416 |
| Total Memory Bits | — | 1,152,000 |
| Embedded Multipliers (18x18) | — | 150 |
| User I/O Banks | — | 8 |
| Supply Voltage - Core | — | 1.15 V to 1.25 V (internal) |
| Supply Voltage - I/O | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-standard) |
| Level MSL | — | 3 (per JEDEC J-STD-020) |
| Configuration Method | — | Serial (AS) or Parallel (PS) via Altera EPCS/EPC configuration devices |