EP2C8F256I6N vs EP2C8F256I8N Perbandingan

Perbandingan bersamaan detil EP2C8F256I6N dari Intel dan EP2C8F256I8N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP2C8F256I6N EP2C8F256I8N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND NRND
Family Cyclone II —
Logic Elements 8,256 —
Logic Array Blocks (LABs) 540 —
Embedded Memory (M4K blocks) 165,888 bits —
Embedded 18 x 18 Multipliers 36 —
Maximum User I/O Pins 182 —
Phase-Locked Loops (PLLs) 4 —
Process Technology 90 nm CMOS 90 nm CMOS (SRAM-based)
Core Supply Voltage 1.2 V (1.15 V min, 1.25 V max) 1.2 V
Maximum Internal Clock Frequency 402.58 MHz —
Speed Grade 6 —
Operating Temperature (Industrial) -40 C to +100 C (Tj) —
Paket 256-ball FineLine BGA (FBGA-256), 1.00 mm pitch —
Configuration Modes JTAG, Active Serial (AS), Passive Serial (PS) —
Status RoHS Lead-free / RoHS compliant (N suffix) Compliant (Pb-free, lead-free reflow compatible)
Series — Cyclone II
Logic Elements (LEs) — 8,256
Embedded Memory Bits — 165,888 bits
Total RAM Bits — 165,888
Logic Blocks / Logic Cells — 540 (Logic Cells)
User I/O Pins — 182
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
Embedded 18x18 Multipliers — Up to 36
PLLs — 2
Global Clock Networks — 16
I/O Supply Voltage — 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent)
Package Type — 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch
Suhu Kerja — -40C to +85C (industrial)
Configuration Method — SRAM, loaded from external EPCS flash at power-up
Tipe Mounting — Surface Mount (BGA)

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