EP2C8F256I6N vs EP2C8F256I8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2C8F256I6N sa pamamagitan ng Intel at EP2C8F256I8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2C8F256I6N EP2C8F256I8N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND NRND
Family Cyclone II —
Logic Elements 8,256 —
Logic Array Blocks (LABs) 540 —
Embedded Memory (M4K blocks) 165,888 bits —
Embedded 18 x 18 Multipliers 36 —
Maximum User I/O Pins 182 —
Phase-Locked Loops (PLLs) 4 —
Process Technology 90 nm CMOS 90 nm CMOS (SRAM-based)
Core Supply Voltage 1.2 V (1.15 V min, 1.25 V max) 1.2 V
Maximum Internal Clock Frequency 402.58 MHz —
Speed Grade 6 —
Operating Temperature (Industrial) -40 C to +100 C (Tj) —
Packhaging 256-ball FineLine BGA (FBGA-256), 1.00 mm pitch —
Configuration Modes JTAG, Active Serial (AS), Passive Serial (PS) —
Tindminan RoHS Lead-free / RoHS compliant (N suffix) Compliant (Pb-free, lead-free reflow compatible)
Series — Cyclone II
Logic Elements (LEs) — 8,256
Embedded Memory Bits — 165,888 bits
Total RAM Bits — 165,888
Logic Blocks / Logic Cells — 540 (Logic Cells)
User I/O Pins — 182
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
Embedded 18x18 Multipliers — Up to 36
PLLs — 2
Global Clock Networks — 16
I/O Supply Voltage — 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent)
Package Type — 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch
Temperature na Operasyon — -40C to +85C (industrial)
Configuration Method — SRAM, loaded from external EPCS flash at power-up
Uri ng Pagpapasok — Surface Mount (BGA)

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita