EP2SGX130GF40C4NES vs EP2SGX130GF40C3N Perbandingan

Perbandingan bersamaan detil EP2SGX130GF40C4NES dari Intel dan EP2SGX130GF40C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP2SGX130GF40C4NES EP2SGX130GF40C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Waktu Pembelian Terakhir Obsolete
Family Stratix II GX Stratix II GX
Logic Elements 132,540 132,540
Logic Blocks / ALMs Approximately 53,000 ALMs —
Process Technology 90 nm CMOS 90 nm
Core Voltage 1.2 V 1.2 V
Maximum Transceiver Data Rate 6.375 Gbps —
Transceiver Channels Up to 20 (4 to 20, device-dependent) —
User I/O Pins 734 —
Total Package Pins 1508 (FC-FBGA ball grid) —
Package Code GF40 (FC-FBGA, 40x40 mm, 1.0 mm pitch) —
Speed Grade C4 (speed grade -4) C3
Internal Operating Frequency Up to 717 MHz —
Embedded Memory Approximately 4.5 Mbits (TriMatrix) 6.7 Mbits
PLL Blocks 8 —
DSP Blocks Yes (variable, see datasheet) —
Tipe Mounting Surface Mount (flip-chip BGA) Surface Mount (flip-chip BGA)
Lead-Free / RoHS Yes (LEAD FREE per datasheet family code) —
Level MSL Per JEDEC J-STD-020, typically MSL-4 or higher [DATA_NEEDED: exact MSL level] —
Suhu Kerja Commercial Extended (per N suffix) 0C to +85C (commercial)
JEDEC Standard Reference MS-034AAU-1 —
Embedded Multipliers (18x18) — 252
User I/O Count — 734
Transceiver Count — 40 channels
Max Transceiver Data Rate — 6.375 Gbps
Paket — 1508-ball FC-FBGA
Configuration Mode — Passive Serial / Fast Passive Parallel / JTAG
Status RoHS — Compliant

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