EP2SGX130GF40C4NES vs EP2SGX130GF40C3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX130GF40C4NES sa pamamagitan ng Intel at EP2SGX130GF40C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2SGX130GF40C4NES EP2SGX130GF40C3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Obsolete
Family Stratix II GX Stratix II GX
Logic Elements 132,540 132,540
Logic Blocks / ALMs Approximately 53,000 ALMs —
Process Technology 90 nm CMOS 90 nm
Core Voltage 1.2 V 1.2 V
Maximum Transceiver Data Rate 6.375 Gbps —
Transceiver Channels Up to 20 (4 to 20, device-dependent) —
User I/O Pins 734 —
Total Package Pins 1508 (FC-FBGA ball grid) —
Package Code GF40 (FC-FBGA, 40x40 mm, 1.0 mm pitch) —
Speed Grade C4 (speed grade -4) C3
Internal Operating Frequency Up to 717 MHz —
Embedded Memory Approximately 4.5 Mbits (TriMatrix) 6.7 Mbits
PLL Blocks 8 —
DSP Blocks Yes (variable, see datasheet) —
Uri ng Pagpapasok Surface Mount (flip-chip BGA) Surface Mount (flip-chip BGA)
Lead-Free / RoHS Yes (LEAD FREE per datasheet family code) —
Level ng MSL Per JEDEC J-STD-020, typically MSL-4 or higher [DATA_NEEDED: exact MSL level] —
Temperature na Operasyon Commercial Extended (per N suffix) 0C to +85C (commercial)
JEDEC Standard Reference MS-034AAU-1 —
Embedded Multipliers (18x18) — 252
User I/O Count — 734
Transceiver Count — 40 channels
Max Transceiver Data Rate — 6.375 Gbps
Packhaging — 1508-ball FC-FBGA
Configuration Mode — Passive Serial / Fast Passive Parallel / JTAG
Tindminan RoHS — Compliant

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