EP2SGX30CF780C3 vs EP2SGX30CF780C7 Perbandingan
Perbandingan bersamaan detil EP2SGX30CF780C3 dari Intel dan EP2SGX30CF780C7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2SGX30CF780C3 | EP2SGX30CF780C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Family | Stratix II GX | — |
| Logic Elements | 33,880 | 33,000 |
| Logic Array Blocks (LABs) | 1,694 | — |
| Embedded RAM Bits | 1,369,728 | — |
| User I/Os | 361 | — |
| Paket | 780-ball FineLine BGA | 780-ball FineLine BGA (CF780) |
| Process Node | 90 nm | — |
| Speed Grade | -3 | C7 (fastest commercial) |
| Suhu Kerja | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Transceivers | Embedded (GX family, up to 3.125 Gbps per channel) | — |
| Memory Interfaces | DDR / DDR2 / QDRII PHY | — |
| Tipe Mounting | Surface Mount (BGA) | — |
| Status RoHS | Compliant | Compliant (lead-free Fineline BGA) |
| Lead-Free | Yes | — |
| Bebas Halogen | [DATA_NEEDED: halogen-free status] | — |
| Series | — | Stratix II GX |
| Embedded Memory | — | 1.9 Mbits |
| DSP Blocks (18x18 multipliers) | — | 256 |
| Maximum User I/O | — | 361 |
| Multi-Gigabit Transceivers | — | 4 channels |
| Transceiver Data Rate | — | 600 Mbps to 3.125 Gbps |
| PLLs | — | 4 |
| Core Voltage | — | 1.2 V |
| Process Technology | — | 90 nm |
| Ball Pitch | — | 1.0 mm |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous, JTAG |