EP2SGX30CF780C3 vs EP2SGX30CF780C7 比較
詳細並排比較 EP2SGX30CF780C3 由 Intel 與 EP2SGX30CF780C7 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2SGX30CF780C3 | EP2SGX30CF780C7 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | NRND |
| Family | Stratix II GX | — |
| Logic Elements | 33,880 | 33,000 |
| Logic Array Blocks (LABs) | 1,694 | — |
| Embedded RAM Bits | 1,369,728 | — |
| User I/Os | 361 | — |
| 封裝 | 780-ball FineLine BGA | 780-ball FineLine BGA (CF780) |
| Process Node | 90 nm | — |
| Speed Grade | -3 | C7 (fastest commercial) |
| 工作溫度 | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Transceivers | Embedded (GX family, up to 3.125 Gbps per channel) | — |
| Memory Interfaces | DDR / DDR2 / QDRII PHY | — |
| 安裝類型 | Surface Mount (BGA) | — |
| RoHS 狀態 | Compliant | Compliant (lead-free Fineline BGA) |
| Lead-Free | Yes | — |
| 無鹵素 | [DATA_NEEDED: halogen-free status] | — |
| Series | — | Stratix II GX |
| Embedded Memory | — | 1.9 Mbits |
| DSP Blocks (18x18 multipliers) | — | 256 |
| Maximum User I/O | — | 361 |
| Multi-Gigabit Transceivers | — | 4 channels |
| Transceiver Data Rate | — | 600 Mbps to 3.125 Gbps |
| PLLs | — | 4 |
| Core Voltage | — | 1.2 V |
| Process Technology | — | 90 nm |
| Ball Pitch | — | 1.0 mm |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous, JTAG |